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Metalink Special Alloys Corporation
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Sputtering target for thin film coating
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
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ni/cr sputtering target for decorating coating
Specification: round, plate, rotary various size standard or customized
Detail: Cr Target Fbrication Tchnique Powder Metallery Purity 99.5%-99.95%(2N5~3N5) Grain Size �00μm
2
alcr sputtering target
Specification: various size standard or customized
Detail: AlCr Target Fbrication Tchnique Powder Metallery Purity 99.7%-99.8%(2N7~2N8) Ingredient Proportion 70/30,50/50 Grain Size �00μm
3
niv sputtering target for semi-conducter coating
Specification: various size standard or customized
Detail: NiV Target Fbrication Tchnique Vacuum Melting+Forging+ Rolling Purity 99.95%(3N5) Ingredient Proportion 93/7 Grain Size �00μm
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
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