Metalink Special Alloys Corporation

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ni/cr sputtering target for decorating coating
Specification: round, plate, rotary various size standard or customized
Detail: Cr Target Fbrication Tchnique Powder Metallery Purity 99.5%-99.95%(2N5~3N5) Grain Size ï¼?00Î¼m

alcr sputtering target
Specification: various size standard or customized
Detail: AlCr Target Fbrication Tchnique Powder Metallery Purity 99.7%-99.8%(2N7~2N8) Ingredient Proportion 70/30,50/50 Grain Size ï¼?00Î¼m

niv sputtering target for semi-conducter coating
Specification: various size standard or customized
Detail: NiV Target Fbrication Tchnique Vacuum Melting+Forging+ Rolling Purity 99.95%(3N5) Ingredient Proportion 93/7 Grain Size ï¼?00Î¼m

tial sputtering target for hard coating
Specification: various size standard or customized
Detail: AlTi Target Fbrication Tchnique: Powder Metallery Purity 99.7%-99.8%(2N7~2N8) Ingredient Proportion 25/75,30/70,33/67,40/60,50/50,33/67,75/25 Grain Size ï¼?00Î¼m

nicr sputtering targets for glass coating
Specification: round, plate, rotary various size standard or customized
Detail: NiCr Split Joint Planar Target Fbrication Tchnique Vacuum Melting+Forging+Rolling Purity 99.5%-99.95%(2N5~3N5) Ingredient Proportion 80/20, 90/10 Grain Size ï¼?00Î¼m --------------------------------------------------...

sputtering targets for pvd coating for glass, hard
Specification: round, plate, rotary various size standard or customized
Detail: NiCr Split Joint Planar Target Fbrication Tchnique Vacuum Melting+Forging+Rolling Purity 99.5%-99.95%(2N5~3N5) Ingredient Proportion 80/20, 90/10 Grain Size ï¼?00Î¼m --------------------------------------------------...


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